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Which Fabrication Is Used for Assembly of the Circuit Board?

ByRenu Yadav

Jul 21, 2021
Metal core printed circuit board

You know the costly consequence of failure when you order printed circuit boards (PCB). The last thing you need financially is for your PCBs to go dead suddenly – or to shorten their life due to a design or QA problem.

PCB assembly test methods are a component of the process of production. Reputable electronic contracts manufacturers(ECMs) offer several methods of PCB testing, which is enough to keep them straight sometimes.

1) In-Circuit Testing

The most robust type of PCB testing available is in-circuit testing (ICT). The cost depends, among other factors, on the size of the board and fittings, reflecting the high price for the testing. An ICT, also known as an on-board bed test, enables the individual circuit board to operate and control. The test is usually intended for a coverage of 100 percent, but the coverage is 85-90%. The nice thing with ICT is the 85-90% you get is completely free from human mistakes. This test consists of the use of fixed samples designed to match the design of the PCB. The samples check the solder connection’s integrity. The tester of nails just pushes down the board on the sample bed to begin the test. The board has pre-designed access points that make connections with the circuit by ICT test samples. You put some pressure on the connection to ensure that it remains intact.ICT is often done on larger ball-grid arrays and connections (BGAs).

2) Automated Optic Inspection(Aoi)

To photograph the PCB, AOI uses either a single 2D or two 3D cameras. The program compares your photographs with a detailed scheme. If there is a board not to a certain degree in line with the schematic, a technician shall flag the board for inspection.

AOI may be useful for early detection of problems to ensure that ASAP is shut down. It does not, however, power up the board and does not cover all part types by 100 percent.

Burn-In Testing

Burn-in testing, as the name suggests, is a more intensive type of PCB testing. It has been designed for early detection and load capacity determination. Burn-in tests can be harmful to the parts tested because of their intensity burn-in tests push your electronics power, usually at its maximum capacity. The power is continually running 48 to 168 hours through the board. Failure of a board is referred to as child mortality. Boards with high infant mortality are not ideal for military and medical applications.

Burn-in testing is not for every project, but it makes a lot of sense to some. Before they reach customers, they can avoid embarrassing or dangerous product launches. Just remember that burn-in testing can shorten the life of the product, especially if the test is more stressful than the test. If only a few or no defects are identified, after a short time, the test limit can be reduced to prevent your PCBs from being overstressed.

X-RAY testing

This testing type is also known as an AXI, at least for most ECMs, actually more of an inspection tool. During this test, an x-ray technician can locate defects by viewing: early in the production process:

1 Connection for soldering

2 Traces internally

3 Barrels

2D and 3D AXI tests are available, and 3D offers a quicker testing time. X-ray testing can control elements that are usually hidden out of views, such as connections and soldered joints ball grid packages under the chip. Although this inspection can be very useful, trained, experienced operators are required.

It may be a challenge to figure out which PCB tests are right for you. Your ECM will know which tests are appropriate for your specific needs. And remember, prototyping PCBs. This key element of product launches is a self-test that enables you to view the real thing before your market takes place.

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Renu Yadav
Author: Renu Yadav